
Product Catalog
I. Intelligent Biosignal Processing Chip Series (Nemesis IC Series)
This chip series is specifically designed for wearable medical devices, offering high-precision analog signal acquisition and intelligent processing capabilities.

| Model | Product Definition | Core Applications | Status |
| NMS4110 | Electrochemical Sensing ROIC | Continuous Glucose Monitoring (CGM), ECG | Mass Production 2024 |
| NMX3210 | Programmable Multi-channel CDC | Force & Torque Sensing | Launched |
| NMS2110 | Bio-impedance Measurement IC (Bio-Z) | Body Composition, Proximity Sensing | Launched |
| NMI1000 | Programmable CDC SOC | Image Sensing, Capsule Endoscopy | Mass Production 2024 |
II. TIPS Lithium-Ion Battery Thermal Runaway Warning Modules
Engineered for Industrial Battery Energy Storage Systems (BESS) and residential storage, these modules offer extreme power efficiency in a miniaturized package.
Core Model: BSM3-R (Latest Generation)
- Sensing Technology: Patented electrochemical gas sensing (Detects First Venting).
- Ultra-Low Power: Operating power $< 1$ mW (A decisive advantage over the 275 mW consumed by competitors).
- Ultra-Compact Size: $20 \times 20 \times 8$ mm (One of the smallest solutions currently available on the market).
- Communication Interface: Supports GPIO / RS-485 / CAN Bus (Optional).
- Alarm Response: Triggers alarm signal within 20 seconds of detecting abnormal gas venting.


III. Technical Comparison
1. TIPS Warning Module Competitive Analysis
| Specification | TIPS BSM3-R | Competitor A | Competitor B |
| Power Consumption | $< 1$ mW | 275 mW | ~150 mW |
| Cost | $< \text{US\$ } 20$ | ~US$ 33.46 | High |
| Alarm Timing | $< 20$ sec | Slow (Post-Runaway) | Slow (Temp Triggered) |
| Installation | Very Low (PCB Integration) | High (External Wiring) | Medium |
2. Nemesis Technical Moat
- Customization Capability: Supports customized ROIC development for specific biomarkers.
- Edge AI Integration: Built-in Tiny Machine Learning (TinyML) engine allows for intelligent diagnostics without the need for an external MCU.